Printed Circuit Board Assembly - 101
Printed circuit board (PCB) with insulation board as basic material, completes point connection and prints the electronic components according to design. The assembly system of printed circuit board is known as surface mount assembly system, with both computer integrated manufacturing and flexible manufacturing and other advanced manufacturing system characteristics, mainly in the application of Surface
Mount Technology (SMT). At present, the printed circuit assembly industry is in small quantities and multi-types production environment. Only in the shortest time with minimal defect and cost to obtain the maximum output, it is to adapt to production requirements of many varieties, multitasking and multi-user. Therefore, there is important practical significance in SMT line optimization design study on the PCB board.
We discuss these methods in detail.
Conductive wire
If only a single extrusion is accessible, the design should be divided into two main parts. It is also possible to create multiple layers, but first, you need to master the mechanics of double layers. The steps involved in this process can be summarized as follows:
1. Begin the process by modeling a pattern that corresponds to a few layers high. Leave holes for mounting external components. This pattern will act as imprinted traces on the conductive material.
2. After modeling the model, you will create a base print that will fill in the gaps between and around the circuits. You can do this by simply subtracting the first step style from the solid block.
3. When aligning the associated coordinates, the two designs from the first two steps must be saved differently. The model can now be cut and uploaded to the 3D printer.
4. The conductive filament can now be loaded and traces printed.
5. Now load the non-conductive filament and print the second model without removing any traces. You have now created a solid color print with two different materials.
Now that you have a 3D printed circuit board, the components are connected the same way they would be on a normal printed circuit board. During this process, care should be taken that the soldering iron is not too close to the plate.
There are various conductive filaments on the market. Most conductive variants of filaments, such as acrylonitrile butadiene styrene (ABS), polylactic acid or polylactide (PLA), polystyrene is often referred to as HIPS or thermoplastic polyurethane (TPU), which are used in 3D in the printed circuit board. Most of these filaments contain graphene, a semiconductor, and allow these filaments to conduct electricity. Conducting electricity is not as efficient as metal, but still enough to make efficient printed circuit boards.
